he stress on the output transistor is determined by the output current and the output voltage VS-VO of the conductive output transistor
Power consumption depends on power supply,
PowerPAD Thermal Enhancement Components
PowerPAD Thermal Enhancement Components
OPA445 provides a heat enhanced PowerPAD package. This packaging uses a bottom mounted lead frame with a mold installed on top.
Connect all holes to an internal power plane with the correct voltage potential (V -).
